DFM, mold Flow analysis, and mold design
25-person engineering team, including 6 senior engineers with over 20 years of expertise.
Rapid toolings and production toolings
In-house tool manufacturing (We never outsource)
Commodity Thermoplastics (PP, PE, PS, PVC, PMMA): Cost-effective materials suitable for high-volume production of non-structural or low-load components
Engineering Plastics (ABS, PC, , PC+ABS,Nylon, POM, PBT, ASA): Balanced mechanical strength, heat resistance, and dimensional stability for electronic housings and functional parts
High-Performance Polymers (PEEK, PPS, PEI, LCP): Exceptional thermal, chemical, and electrical performance for demanding and high-reliability applications
Thermosetting Polymers (Epoxy, Silicone): Irreversible curing materials with excellent electrical insulation and heat resistance for encapsulation and sealing
Modified Compounds (Glass-filled, Flame-retardant, Reinforced Plastics): Customized formulations with enhanced strength, stiffness, or flame resistance
This plastic casing is used for the casing of the industrial gas monitor. The product is divided into two parts: the upper and lower covers. At the same time, a TPU coated part is made on the upper part of the casing, which is anti-drop, looks beautiful and feels good touching effect.
View More| Material | Key Properties | Advantages | Disadvantages | Typical Applications |
| PC+ABS | High strength, good heat resistance, excellent surface finish | Best overall balance, easy to mold, flame-retardant options (UL94 V-0) | Slightly higher cost than ABS | Consumer electronics, control panels, smart devices |
| ABS | Low cost, easy processing, good surface quality | Cost-effective, good appearance | Lower heat resistance, not UV resistant | Indoor electronic enclosures |
| PC | High strength, high heat resistance, transparent | Excellent impact resistance, premium material | Higher cost, harder to process | High-end electronics, transparent housings |
| PBT | Good electrical insulation, dimensional stability | Ideal for electrical parts, stable performance | Less aesthetic, relatively brittle | Connectors, internal components |
| ASA | UV-resistant, weather-resistant | Suitable for outdoor use, anti-aging | Higher cost than ABS | Outdoor enclosures, telecom equipment |
Plastic molding is often better than metal for electronic device casings because it offers lower cost, lighter weight, greater design flexibility, and easier mass production. It also provides good electrical insulation and allows complex shapes to be formed in a single process.
However, metal may be preferred in applications requiring higher strength, superior heat dissipation, or electromagnetic shielding (EMI).
| Challenge | Main Causes | Solutions |
| Sink Marks | • Uneven or thick wall design • Insufficient packing pressure/time • Uneven cooling • Poor gate location • High material shrinkage | • Optimize part design (uniform wall thickness) • Increase packing pressure and time • Improve cooling system layout • Adjust gate location and size • Select low-shrinkage materials |
| Burn Marks (Gas Traps) | • Poor venting • Excessive injection speed • Air trapped in closed areas • Material degradation due to overheating • Poor runner or flow path design | • Add venting slots or vent pins • Reduce injection speed • Optimize flow path to avoid air traps • Control melt temperature • Use suitable and stable materials |
| Stress Marks / Gloss Marks | • Excessive injection pressure • Poor ejection system • Uneven mold temperature • Rough mold surface • Uneven cooling rate | • Optimize molding parameters • Improve ejection design (angle/pin layout) • Balance mold temperature • Enhance mold polishing (SPI standard) • Optimize cooling channels |
| Flash | • Insufficient clamping force • Mold mismatch or parting line gaps • Excessive injection pressure • Mold wear over time • Insufficient mold rigidity | • Increase clamping force • Improve mold precision and fitting • Reduce injection pressure • Perform regular mold maintenance • Reinforce mold structure |
| Flow Marks / Gas Marks | • Unstable melt flow • Improper temperature settings • Poor gate design • Insufficient material drying • Injection speed fluctuation | • Optimize process parameters • Control melt and mold temperatures • Improve gate design and position • Ensure proper material drying • Stabilize injection speed |


